SMT double-side material connection tape basic process analysis screen printing (or glue dispensing) ---- -- mounting (curing) -- reflow welding -- cleaning -- detection ---- ---- -- repair screen printing: its function is to miss the solder paste or patch glue to the circuit board of the welding pad, for the components of the welding preparation. The equipment used is silk screen printing machine (screen printing machine), which is located at the front end of SMT material receiving belt production line.
Glue dispensing: it drops glue to the fixed position of circuit board, and its main function is to fix components to the circuit board. The equipment used is glue dispensing machine, which is located at the front end of SMT material receiving belt production line or behind the testing equipment.
Mounting: the function of this device is to accurately install the surface assembled components to the fixed position of the circuit board. The equipment used is placement machine, which is located behind the screen printing machine in SMT material receiving belt production line.
Cleaning: the function is to remove the harmful welding residue such as flux from the assembled circuit board. The equipment used is cleaning machine, the position may not be fixed, may be online, may not be online.
Detection: its function is to test the welding quality and assembly quality of the assembled circuit board. The equipment used includes magnifying glass, microscope, on-line tester (ICT), flying needle tester, automatic optical testing (AOI), X-ray testing system, functional tester, etc. The location can be configured in the appropriate place of the production line according to the needs of inspection.
Repair: its role is to detect the failure of the circuit board rework. The tools used are soldering iron, repair workstation, etc. Configured anywhere in the production line.
Solidification: its function is to melt the patch adhesive, so that the surface assembled components and circuit board are firmly bonded together. The equipment used is curing furnace, which is located behind the mounter in SMT receiving belt production line.
Reflow soldering: the function of this is to melt the solder paste and make the surface-assembled components firmly stick to the circuit board. The equipment used is a reflow soldering furnace located behind the mounter in the SMT strip production line.
